Modified leadframe design with adhesive overflow recesses

ABSTRACT

The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.

BACKGROUND Technical Field

The present disclosure is directed to a leadframe design that resistsadhesive creep, and in particular to a leadframe with etched recesses toprovide overflow reservoirs for semiconductor die glue.

Description of the Related Art

Semiconductor packages often include a semiconductor die and a leadframethat provides an interface between contacts and the semiconductor die.The semiconductor package can include an encapsulant to secure theelements of the package into a single discrete unit. The semiconductordie is typically placed on the leadframe, and the combination is coveredwith encapsulant in an application chamber. The encapsulant is typicallyapplied at high pressure or temperature, and is then allowed to cool andsolidify around the package elements.

Glue can provide superior electrical and thermal characteristics over adie attach film for attaching a die to a leadframe. Unfortunately, asdie sizes continue to shrink, manufacturing with glue becomes moreproblematic due to adhesive creep, as can be appreciated from FIGS. 1-4.

As shown in FIG. 1, a chip package 100 includes a leadframe 101 with amain body 102 having a top surface 104. The leadframe 101 also includesa lead 106 separated from the main body 102 by an opening 108. Asemiconductor die 110 with a bottom surface 112 is positioned over themain body 102 with a layer of adhesive 114 on the top surface 104.

FIG. 2 depicts the semiconductor die 110 just as it is lightly placedonto the adhesive 114. There has been no pressure applied to compressthe semiconductor die 110 onto the leadframe 101. The weight of thesemiconductor die 110 has caused the adhesive 114 to be pushed to theedges of the semiconductor die 110. FIG. 3 depicts the semiconductorcoming to a rest fully compressed onto the adhesive 114. Due to theinteraction of the adhesive with the surfaces of the main body 102 andthe semiconductor 110, the adhesive creeps up a side surface 302 of thesemiconductor 110. In some cases the adhesive may spread onto a topsurface 304 of the semiconductor die 110.

FIG. 4 depicts the final steps to completing the chip package 100. Abond wire 402 is electrically coupled at a first end to a contact on thetop surface 304 of the semiconductor die, and is electrically coupled ata second end to the lead 106. Then the entire assembly is covered withan encapsulant 406. As can be appreciated from FIG. 4, the adhesive islocated between the semiconductor die 110 and the leadframe 101. In mostembodiments, the adhesive is in contact with the bottom surface 112.

The adhesive 114 can be electrically conductive or insulating dependingon the design choice. The adhesive 114 may also be a thermal insulatoror a thermal conductor, depending on the design choice. In most priorart chip packages, the adhesive 114 is both an electrical conductor anda thermal conductor so that the back side of semiconductor die 110 iselectrically connected to ground and acts to transfer heat from thesemiconductor die 110 to the leadframe 101.

Adhesive creep may create an electrical or thermal coupling between theadhesive 114 and one or more contacts on the top surface 304, shortingsome of the contacts together or to ground. Adhesive creep could alsocover the die bond pad and prevent successful wire bonding. Because ofadhesive creep, current adhesives can only be used with semiconductordice that are at least 150 micrometers in thickness to prevent creepfrom coupling to top surface contacts. If the die is too thin, theadhesive may creep up the side more easily. Thus, what is needed is adevice that prevents adhesive from creeping up the side surface of athin semiconductor die.

BRIEF SUMMARY

The present disclosure is directed to a leadframe that prevents dieadhesive from creeping up sides of a die attached to the leadframe. Asthe die and leadframe are coupled together during manufacturing,adhesive between the die and the leadframe expands in surface areacovered and may flow towards the perimeter of the die. The leadframeincludes at least one recess that collects excess adhesive to preventthe adhesive from reaching the perimeter of the die and climbing up aside surface of the die due to cohesive forces between the adhesive andthe die. In some embodiments, the recess may extend around all sides ofa main body of the leadframe, thus providing an isolated, die pad on themain body of the leadframe that the die attaches to.

In one embodiment, the leadframe may also include an encapsulant anchoraround the edges of the main body of the leadframe, the encapsulantanchor reinforcing the connection between an encapsulant and the mainbody of the leadframe. The encapsulant anchor reinforces the connectionto the encapsulant by increasing surface area of the joint and also bycreating a hook and catch connection between the main body of theleadframe and the encapsulant. The anchors also act as additionalbarriers to moisture that make it more difficult for moisture to reachthe die.

The present disclosure is also directed to methods of manufacturing aleadframe having at least one recess for receiving excess adhesiveduring manufacturing of a die. In one embodiment, the method ofmanufacturing may also include forming the encapsulant anchor describedabove. A method of forming a final package is also disclosed.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIGS. 1-4 are cross-sectional views of a leadframe during various stagesof a manufacturing process, as is known in the prior art.

FIG. 5 is an isometric view of an exemplary leadframe having a recessaround a perimeter of the main body.

FIGS. 6 and 7 are cross-sectional views of an exemplary leadframe duringvarious stages of a manufacturing process, with FIG. 7 being taken alongline A-A of FIG. 5.

FIG. 8 is an isometric view of an exemplary leadframe at one stage ofthe manufacturing process.

FIG. 9 is an isometric view of an alternate embodiment of an exemplaryleadframe during a stage of the manufacturing process.

FIG. 10 is a cross-sectional view taken along line B-B of the exemplaryleadframe shown in FIG. 8.

FIGS. 11-14 are cross-sectional views of an exemplary leadframe duringvarious stages of the manufacturing process.

FIG. 15 is a cross-sectional view of an alternate embodiment of anexemplary leadframe having recesses and anchors.

FIGS. 16 and 17 are isometric views of alternate embodiments of anexemplary leadframe.

FIG. 18 is a cross-sectional view of an alternate embodiment of anexemplary leadframe having recesses and anchors.

FIGS. 19 and 20 are isometric views of alternate embodiments of anexemplary leadframe.

FIG. 21 is a cross-sectional view of an alternate embodiment of anexemplary leadframe having rounded recesses and anchors.

FIG. 22 is a plan view of an alternate embodiment having a plurality ofrecesses.

FIG. 23 is an isometric view of the alternate embodiment shown in FIG.22.

FIGS. 24 and 25 are isometric views of alternate embodiments having aplurality of recesses.

DETAILED DESCRIPTION

In the following description, certain specific details are set forth inorder to provide a thorough understanding of various embodiments of thedisclosure. However, one skilled in the art will understand that thedisclosure may be practiced without these specific details. In otherinstances, well-known structures associated with electronic componentsand fabrication techniques have not been described in detail to avoidunnecessarily obscuring the descriptions of the embodiments of thepresent disclosure.

Unless the context requires otherwise, throughout the specification andclaims that follow, the word “comprise” and variations thereof, such as“comprises” and “comprising,” are to be construed in an open, inclusivesense; that is, as “including, but not limited to.”

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure or characteristicdescribed in connection with the embodiment is included in at least oneembodiment. Thus, the appearances of the phrases “in one embodiment” or“in an embodiment” in various places throughout this specification arenot necessarily all referring to the same embodiment. Furthermore, theparticular features, structures, or characteristics may be combined inany suitable manner in one or more embodiments.

As used in this specification and the appended claims, the singularforms “a,” “an,” and “the” include plural referents unless the contentclearly dictates otherwise. It should also be noted that the term “or”is generally employed in its sense including “and/or” unless the contentclearly dictates otherwise.

As used in the specification and appended claims, the use of“correspond,” “corresponds,” and “corresponding” is intended to describea ratio of or a similarity between referenced objects. The use of“correspond” or one of its forms should not be construed to mean theexact shape or size.

Throughout the specification, the term “layer” is used in its broadestsense to include a thin film, a cap, or the like, and one layer may becomposed of multiple sub-layers.

Specific embodiments of chip packages are described herein; however, thepresent disclosure and the reference to certain materials, dimensions,and the details and ordering of processing steps are exemplary andshould not be limited to those shown.

The present disclosure is generally directed to chip packages, such as achip package 600 shown in FIG. 5. The chip package 600 includes aleadframe 601 having a main body 602 with a top surface 702 and a lead604 separated from the main body 602 of the leadframe 601 by a space606. There is a recess 704 formed in the main body 602 of the leadframe601 forming a die attach pad 708 in the main body 602 (see also FIG. 7).As a semiconductor die is positioned on the die attach pad 708, excessadhesive between the semiconductor die and the die attach pad 708 flowinto the recess 704 covering a recess surface 706 instead of adhering toa side surface of the semiconductor die.

FIGS. 6-8 and 10-14 are views of a chip package in various stages of amanufacturing process. FIG. 14 represents one embodiment of a finishedchip package, beginning with the leadframe shown in FIG. 6. FIG. 6 is across-sectional view of a leadframe with a main body and leads. FIG. 7is a cross-sectional view of the leadframe of FIG. 5 taken atcross-section line A-A, with FIGS. 5 and 7 showing the leadframe of FIG.6 after having recesses etched into a top surface of the main body. FIG.8 is an isometric view of the leadframe of FIGS. 5 and 7 with anadhesive on the die pad on the main body. FIG. 9 is an isometric view ofan alternate embodiment of FIG. 8 with a different pattern of adhesiveon the die pad on the main body. FIG. 10 is a cross-sectional view ofthe leadframe of FIG. 8 taken at cross-section line B-B. FIGS. 11-13 arecross-sectional views of the die being positioned on the leadframe andthe resulting behavior of the adhesive as it is compressed between thedie and the leadframe. FIG. 14 is a cross-sectional view of the chippackage of FIG. 13 after being surrounded by encapsulant. FIGS. 15-21depict isometric and cross-sectional views of alternate embodiments ofchip packages of the present disclosure with a single recess around aperimeter of the main body. FIGS. 22-25 depict isometric andcross-sectional views of alternate embodiments of chip packages of thepresent disclosure with multiple recesses on the main body of theleadframe.

As represented in the cross-sectional view of FIG. 6, assembly of thechip package 600 begins with a leadframe 601. The leadframe 601 includesa main body 602 and a lead 604 separated from the main body 602 by aspace 606. The space 606 may be etched in the leadframe 601 or theleadframe 601 may be formed with the space 606. Typically at this pointin the manufacturing process the lead 604 is still mechanically joinedto the main body 602 by a support bar, stringer or other elements, whichare not shown since they are well known in the art. The leadframe 601may be made or plated with any number of materials, including copper andcopper alloys. In some embodiments, the leadframe 601 has a maximumthickness of 200 micrometers of the main body 602, the lead 604, orboth.

FIG. 7 is a cross-sectional view of the chip package 600 after anetching step. FIG. 7 represents a cross-sectional view of the chippackage 600 shown in FIG. 5, taken at cross-section line A-A. The mainbody 602 of the leadframe 601 has a top surface 702 that is partiallyetched away. The partial etching removes only a portion of the topsurface 702 and the main body 602 to create a recess 704 that does notpenetrate through the entire thickness of the main body 602. In someembodiments, a depth of the recess 704 is less than half of the maximumthickness of the main body 602. In other embodiments, the depth of therecess 704 is more than half of the maximum thickness of the main body602. The shape of the recess 704 may be rectangular, elliptical,irregular, or any other shape.

The recess 704 may be anywhere along the top surface 702. As can beappreciated from FIG. 7, in some embodiments the recess 704 overlaps anedge 605 of the main body 602. In other embodiments, the recess 704 ispositioned in the interior of the top surface 702 on the main body 602.And in some embodiments, there may be more than one recess 704 or therecess 704 may extend around the top surface such that a single recessappears as more than one recess in a cross-sectional view, such as two,three, four, or more recesses. In other embodiments, the recess 704forms a recess or channel in the main body 602. In some embodiments, therecess 704 forms a die pad 708 underneath the remaining top surface 702on the main body 602 of the leadframe 601. The top surface 702 has asurface area greater than or equal to a surface area of a recess surface706, in some embodiments. In other embodiments, the top surface 702 hasa surface area less than a surface area of the recess surface 706. Ascan be appreciated with reference to FIG. 5, the recess surface 706 isdepicted extending around four sides of the main body 602. In otherembodiments, the recess surface 706 extends around more or less sides ofthe main body 602. FIG. 5 depicts the chip package as a 16 pin quad-flatno-leads package; however, other chip packages are used in otherembodiments. For example, a chip package with a different pin count isused in some embodiments. Additionally, a different chip package typemay be used, such as a quad flat package, leadless chip carrier, pingrid array, ball grid array, land grid array, and through-hole chippackages.

FIG. 8 is an isometric view of one embodiment after applying an adhesiveto the leadframe of FIG. 5. In FIG. 8, an adhesive 802 is applieduniformly over the entire top surface of the die pad 708, with theadhesive slightly extending over edges 709 of the top surface. Theadhesive 802 may be any acceptable type of those commonly used in thesemiconductor industry that exhibits a fluid characteristic at any pointduring the manufacturing process. For example, the adhesive 802 can be asintering glue, a semi-sintering glue, or an epoxy, in some embodiments.As is known, the adhesive may include any type and amount of conductivefillings to make it more electrically conductive, such as a silvermaterial for example.

FIG. 9 is an isometric view of an alternate embodiment of the step ofapplying the adhesive to the leadframe of FIG. 5. In FIG. 9, an adhesive902 is applied to the top surface 702 of the die pad 708 as two crossinglines from corners of the top surface 702. Other embodiments havedifferent amounts or different patterns of adhesive applied to aleadframe, to a die, or to both.

FIG. 10 is a cross-sectional view of the chip package shown in FIG. 8taken at cross-section line B-B. The adhesive 802 covers the top surface702 of the die pad 708. The embodiment of FIG. 10 shows that theadhesive 802 extends over sides of the die pad 708. In other embodimentsthe adhesive 802 only covers a portion of the die pad 708. As can beappreciated from FIG. 10, some embodiments have the top surface 702 ofthe die pad 708 coplanar with a top 607 of the lead 604 and in otherembodiments the top 607 of the lead 604 is coplanar with the recesssurface 706. In yet other embodiments, the top of the lead 604 is notcoplanar with either the recess surface 706 or the top surface 702 ofthe die pad 708.

FIG. 11 is a cross-sectional view of the chip package 600 with a die1104 positioned to be placed on the die pad 708, after an adhesiveapplication step. As discussed with respect to FIG. 8, the adhesive 802may cover the entire top surface 702 of the die pad 708, and may extendbeyond the edges of the top surface 702. The semiconductor die 1104 isthen aligned over the die pad 708 to be positioned on the die pad 708and secured using the adhesive 802 that will contact a bottom surface1106 of the semiconductor die 1104. In one embodiment a width of the diepad 708 is less than a width of the semiconductor die 1104. For example,in one embodiment, the footprint area of the die pad, while less thanthe footprint area of the semiconductor die 1104, is more than 80% ofthe footprint area of the semiconductor die 1104. For example, aleadframe with a thickness of 200 μm and a width of about 900 μm wouldhave the semiconductor die 1104 extend between 60 μm and 160 μm over therecess 704, the recess 704 having a width of 300 μm and a depth of 160μm. In one embodiment, the semiconductor die 1104 extends 110 μm overthe recess 704. In another embodiment, the depth of the recess is in therange of 120 μm and, thus, greater than half the total thickness of themain body 602 of the leadframe 601.

FIG. 12 is a cross-sectional view of the chip package 600 at anintermediate step of attaching the semiconductor die 1104 to theleadframe 601. The semiconductor die 1104 is moved towards the leadframe601 and the bottom surface 1106 of the semiconductor die 1104 contactsthe adhesive 802 on the top surface 702 of the die pad 708. Thesemiconductor die 1104 continues to move towards the leadframe 601 fromcompressive forces, causing the adhesive 802 to push towards the sidesof the die pad 708.

FIG. 13 is a cross-sectional view of the chip package 600 with thesemiconductor die 1104 in a final position on the main body 602 of theleadframe 601. As shown in FIG. 13, the adhesive 802 has been pushed tothe sides of the die pad 708 by the compressive forces on thesemiconductor die 1104 and the main body 602. In one embodiment, theadhesive has partially filled the recess 704 and covered a portion ofthe recess surface 706. The recess serves as an overfill reservoir orcatch basin for the adhesive 802. Compared to the prior art shown inFIG. 3, the compressive forces applied during manufacturing have notcaused the adhesive 802 to creep up a side surface 1302 and a topsurface 1304 of the semiconductor die 1104. In contrast, any excessadhesive 802 is collected in the recess 704. The overfill reservoir ofthe recess 704 allows greater tolerances in the amount of die attachadhesive that is applied to the leadframe 601, as a greater amount ofexcess adhesive can be applied without negatively affecting theperformance of the final product.

To prevent any tendency for the adhesive 802 to flow or bleed out frombetween the semiconductor die 1104 and the main body 602, a portion ofthe recess surface 706 may be roughened. The roughening of a portion ofthe recess surface 706 may promote non-wettability of the adhesive 802at the rough surface, stopping or slowing the tendency of the adhesive802 to flow at the rough surface.

In the embodiment of FIG. 13, the die 1104 is shown as havingapproximately the same thickness as the portion of the main body 602below the recess 704. In many embodiments, the die 1104 will be thinnerthan the main body 602. Current designs often have very thin dies and,thus, leadframes to provide ultra-thin packages. Therefore, in someembodiments, the die may be only 40-60 μm thick or even thinner. Inother embodiments, it might be over 200-300 μm thick and, thus, bethicker than the main body 602 of the leadframe 601.

FIG. 14 is a cross-sectional view of the chip package 600 afterencapsulation. The semiconductor die 1104 is electrically coupled to thelead 604 by a bond wire 1402. Then the entire assembly is encapsulatedin an encapsulant 1404. The encapsulant surrounds the semiconductor die1104 and fills the recess 704. The encapsulant 1404 is a moldingcompound, in some embodiments. In other embodiments the encapsulant 1404is any material that provides electrical insulation between thedifferent leads, bond wires, and semiconductor die contacts. In someembodiments, the encapsulant 1404 is an electrical insulator and athermal conductor. In some embodiments, one side of the main body 602 isexposed through one side of the encapsulant 1404. In those embodiments,the main body 602 may provide electrical or thermal coupling between thesemiconductor die 1104 and an external contact. In some embodiments, oneor more sides of the lead 604 are exposed through one or more sides ofthe encapsulant 1404 6 to provide an electrical coupling between thesemiconductor die 1104 and an external contact.

FIG. 15 is a cross-sectional view of a chip package 1500 withencapsulant anchors 1508. Similar to the packages described above, thechip package 1500 includes a leadframe 1501 including a main body 1502,the main body 1502 having a top surface that is split into a top surface1504 and a top surface 1505 by a recess 1506, and the recess 1506 havinga recess surface 1510. In some embodiments the top surface 1504 and thetop surface 1505 are in the same plane. In other embodiments, the topsurface 1504 and the top surface 1505 are not in the same plane. A diepad 1511 on the main body 1502 supports a semiconductor die 1512. Thesemiconductor die 1512 has a bottom surface 1514, a side surface 1516,and a top surface 1518. Between the bottom surface 1514 of thesemiconductor die 1512 and the top surface 1504 of the die pad 1511 isan adhesive 1520 that couples the semiconductor die 1512 to theleadframe 1501.

The adhesive 1520 is compressed between the semiconductor die 1512 andthe die pad 1511 such that excess adhesive is pushed to the sides of thedie pad 1511 and partially fills the recess 1506. The remainder of therecess 1506 is available to receive encapsulant at a later step of themanufacturing process.

The recess 1506 is shown having three sides enclosed and one side openthrough a plane of the top surface 1504 or 1505. The recess of FIGS. 15and 16 may be provided in the form of a trench or a grove in theleadframe 1502, 1602. In this embodiment, a portion of the main body1502 of the leadframe 1501 forms an anchor 1508. The anchor 1508 issurrounded by an encapsulant at a later step of the manufacturingprocess and increases the strength of the mechanical coupling betweenthe leadframe 1501 and the encapsulant. Delamination of the encapsulantfrom the leadframe 1501 may be induced by mechanical, thermal, or otherstresses. The increased strength of the mechanical coupling helpsprevent delamination of the encapsulant from the leadframe 1501 underthose stresses. In one embodiment, the width of the anchor 1508 is 100μm. The recess 1506 also serves to block moisture ingress to the die1512 by providing a serpentine path of extended length moisture musttravel to reach the die from outside of the package. The moisture, if itenters the package, tends to get trapped on an internal corner of anchor1508, preventing it from reaching the die 1512.

FIGS. 16 and 17 are isometric views of alternate embodiments having across-section shown in FIG. 15. Similar to the packages described above,a chip package 1600 includes a leadframe 1601 including a main body 1602and a lead 1604 separated from the main body 1602 by space 1606. Themain body 1602 has a top surface that is split into a top surface 1608and a top surface 1609 by a recess having a recess surface 1610. In someembodiments the top surface 1608 and the top surface 1609 are in thesame plane. In other embodiments, the top surface 1608 and the topsurface 1609 are not in the same plane. The recess forms a die pad 1611on the main body 1602. In later steps of the manufacturing process, asemiconductor die is positioned on the die pad 1611 and secured with anadhesive that couples the semiconductor die to the leadframe 1601.

As shown in FIG. 16, one embodiment of the device depicted in FIG. 15has a rectangular recess through a plane defined by the top surface 1608or the top surface 1609 of the main body 1602. In this embodiment, therecess forms an anchor 1612 between the space 1606 and the recess. Theanchor 1612 is surrounded by an encapsulant at a later step of themanufacturing process and increases the strength of the mechanicalcoupling between the leadframe 1601 and the encapsulant. In otherembodiments, the anchor 1612 may extend around less than four sides ofthe main body 1602, and may not extend over an entire length of anysingle side. The recess is depicted having rectangular shaped etching;however, other etching shapes are possible, including irregular shapes.Additionally, a portion of the recess surface 1610 may be roughened.

Similar to the packages described above, a chip package 1700 includes aleadframe 1701 including a main body 1702 and a lead 1704 separated fromthe main body 1702 by a space 1706. The main body 1702 has a top surfacethat is split into a top surface 1708 and a top surface 1709 by a recesshaving a recess surface 1710. In some embodiments the top surface 1708and the top surface 1709 are in the same plane. In other embodiments,the top surface 1708 and the top surface 1709 are not in the same plane.The recess forms a die pad 1711 on the main body 1702. In later steps ofthe manufacturing process, a semiconductor die is positioned on the diepad 1711 and secured with an adhesive that couples the semiconductor dieto the leadframe 1701.

As shown in FIG. 17, one embodiment of the device depicted in FIG. 15has a rectangular recess through a plane defined by the top surface 1708or the top surface 1709 of the main body 1702. In this embodiment, therecess forms an anchor 1712 between the space 1706 and the recess. Theanchor 1712 is surrounded by an encapsulant at a later step of themanufacturing process and increases the strength of the mechanicalcoupling between the leadframe 1701 and the encapsulant. In otherembodiments, the anchor 1712 may extend around less than four sides ofthe main body 1702, and may not extend over an entire length of anysingle side. The recess is depicted having rectangular shaped etching;however, other etching shapes are possible, including irregular shapes.Additionally, a portion of the recess surface 1710 may be roughened.

In contrast to the anchor 1612 shown in FIG. 16, anchor 1712 has amerlon and crenel pattern, wherein the posts having tops at the topsurface 1709 are merlons and the spaces between the posts are crenels. Abottom surface of the crenel is coplanar with the recess surface 1710,in some embodiments. In other embodiments, the crenel is not coplanarwith the recess surface 1710. Walls of the merlons adjacent to thecrenels may be planar in some embodiments and may be curved in otherembodiments. The merlons have a height from the surface of the crenel tothe top surface 1709, a length along the line of the merlon and crenelpattern, and a width from the space 1706 to the recess. In someembodiments, the height, length, and width of the merlon are equal. Inother embodiments the height is greater than the length or the width ofthe merlon. In some embodiments, the length of the merlon is the same asa length of the crenel. In other embodiments, the length of the merlonis different than the length of the crenel.

FIG. 18 is a cross-sectional view of a chip package 1800 withencapsulant anchors with an overhang. Similar to the packages describedabove, the chip package 1800 includes a leadframe 1801 including a mainbody 1802, the main body 1802 having a top surface that is split into atop surface 1804 and a top surface 1805 by a recess 1806, and the recess1806 having a recess surface 1810. In some embodiments the top surface1804 and the top surface 1805 are in the same plane. In otherembodiments, the top surface 1804 and the top surface 1805 are not inthe same plane. The recess 1806 forms a die pad 1811 on the main body1802, which supports a semiconductor die 1812. The semiconductor die1812 has a bottom surface 1814, a side surface 1816, and a top surface1818. Between the bottom surface 1814 of the semiconductor die 1812 andthe top surface 1804 of the die pad 1811 is an adhesive 1820 thatcouples the semiconductor die 1812 to the leadframe 1801.

The adhesive 1820 is compressed between the semiconductor die 1812 andthe die pad 1811 such that excess adhesive is pushed to the sides of thedie pad 1811 and partially fills the recess 1806. The remainder of therecess 1806 is available to receive encapsulant at a later step of themanufacturing process. The recess 1806 is as described above withrespect to FIGS. 15-17. In addition, a recess 1822 is etched in a sideopposite the top side 1805. The recesses 1806 and 1822 form an anchor1808 having an overhang extending away from the main body 1802. Theanchor 1808 is surrounded by an encapsulant at a later step of themanufacturing process and increases the strength of the mechanicalcoupling between the leadframe 1801 and the encapsulant due tointerlocking of the anchor 1808 and the encapsulant, and due toincreased surface area between the two materials. Delamination of theencapsulant from the leadframe 1801 may be induced by mechanical,thermal, or other stresses. The increased strength of the mechanicalcoupling helps prevent delamination of the encapsulant from theleadframe 1801 under those stresses. This shape of anchor 1808 providesan increased path for moisture to travel form outside the package, thusadditional protection than other designs. In one embodiment, the widthof the anchor 1808 is 200 μm.

FIGS. 19 and 20 are isometric views of alternate embodiments having across-section shown in FIG. 18. Similar to the packages described above,a chip package 1900 includes a leadframe 1901 including a main body 1902and a lead 1904 separated from the main body 1902 by a space 1906. Themain body 1902 has a top surface that is split into a top surface 1908and a top surface 1909 by a recess having a recess surface 1910. In someembodiments the top surface 1908 and the top surface 1909 are in thesame plane. In other embodiments, the top surface 1908 and the topsurface 1909 are not in the same plane. The recess forms a die pad 1911on the main body 1902. In later steps of the manufacturing process, asemiconductor die is positioned on the die pad 1911 and secured with anadhesive that couples the semiconductor die to the leadframe 1901.

As shown in FIG. 19, one embodiment of the device depicted in FIG. 18has a rectangular recess through a plane defined by the top surface 1908or the top surface 1909 of the main body 1902. In this embodiment, therecess forms an anchor 1912 between the space 1906 and the recess. Theanchor 1912 has an overhang that projects outward from the main body1902. The anchor 1912 is surrounded by an encapsulant at a later step ofthe manufacturing process and increases the strength of the mechanicalcoupling between the leadframe 1901 and the encapsulant due tointerlocking of the anchor 1912 and the encapsulant, and due toincreased surface area between the two materials. In other embodiments,the anchor 1912 may extend around less than four sides of the main body1902, and may not extend over an entire length of any single side. Therecess is depicted having rectangular shaped etching; however, otheretching shapes are possible, including irregular shapes. Additionally, aportion of the recess surface 1910 may be roughened.

Similar to the packages described above, a chip package 2000 includes aleadframe 2001 including a main body 2002 and a lead 2004 separated fromthe main body 2002 by a space 2006. The main body 2002 has a top surfacethat is split into a top surface 2008 and a top surface 2009 by a recesshaving a recess surface 2010. In some embodiments the top surface 2008and the top surface 2009 are in the same plane. In other embodiments,the top surface 2008 and the top surface 2009 are not in the same plane.The recess forms a die pad 2011 on the main body 2002. In later steps ofthe manufacturing process, a semiconductor die is positioned on the diepad 2011 and secured with an adhesive that couples the semiconductor dieto the leadframe 2001.

As shown in FIG. 20, one embodiment of the device depicted in FIG. 18has a rectangular recess through a plane defined by the top surface 2008or the top surface 2009 of the main body 2002. In this embodiment, therecess forms an anchor 2012 between the space 2006 and the recess. Theanchor 2012 has an overhang that projects outward from the main body2002. The anchor 2012 is surrounded by an encapsulant at a later step ofthe manufacturing process and increases the strength of the mechanicalcoupling between the leadframe 2001 and the encapsulant due tointerlocking of the anchor 2012 and the encapsulant, and due toincreased surface area between the two materials. In other embodiments,the anchor 2012 may extend around less than four sides of the main body2002, and may not extend over an entire length of any single side. Therecess is depicted having rectangular shaped etching; however, otheretching shapes are possible, including irregular shapes. Additionally, aportion of the recess surface 2010 may be roughened.

In contrast to the anchor 1912 shown in FIG. 19, anchor 2012 has amerlon and crenel pattern, wherein the posts having tops at the topsurface 2009 are merlons and the spaces between the posts are crenels. Abottom surface of the crenel is coplanar with the recess surface 2010,in some embodiments. In other embodiments, the crenel is not coplanarwith the recess surface 2010. Walls of the merlons adjacent to thecrenels may be planar in some embodiments and may be curved in otherembodiments. The merlons have a height from the surface of the crenel tothe top surface 2009, a length along the line of the merlon and crenelpattern, and a width from the space 2006 to the recess. In someembodiments, the height, length, and width of the merlon are equal. Inother embodiments the height is greater than the length or the width ofthe merlon. In some embodiments, the length of the merlon is the same asa length of the crenel. In other embodiments, the length of the merlonis different than the length of the crenel.

FIG. 21 is a cross-sectional view of a chip package 2100. Similar to theembodiments discussed above, the chip package 2100 includes a leadframe2101 having a main body 2102 with a top surface 2104 and a lead 2106separated from the main body 2102 of the leadframe 2101 by a space 2108.Attached to the leadframe 2101 is a semiconductor die 2110 having abottom surface 2112, a side surface 2114, and a top surface 2116.Between the bottom surface 2112 of the semiconductor die 2110 and thetop surface 2104 of the main body 2102 is an adhesive 2118. There is arecess 2120 formed in the main body 2102 of the leadframe 2101 forming adie pad 2121 in the main body 2102. As the semiconductor die 2110 ispositioned on the die pad 2121, excess adhesive 2118 flows into therecess 2120 instead of adhering to the side surface 2114 and the topsurface 2116 of the semiconductor die 2110. As can be appreciated fromFIG. 21, a wall of the recess 2120 may partially form a wall of ananchor 2122 for securing an encapsulant to the leadframe 2101. Theanchor 2122 has a top surface 2105 that may be coplanar with the topsurface 2104 of the die pad 2121. In addition, a recess 2124 may beetched through a side surface of the main body 2102 to modify the shapeof the anchor 2122. The anchor 2122 may increase the strength of thebond between the encapsulant and the leadframe 2101, protecting theintegrity of the bond between leadframe 2101 and the encapsulant understress, such as thermal or mechanical stresses. The recess 2120 is inthe form of a groove, trench, or a moat that surrounds the die pads2121.

FIG. 22 is a plan view of an alternate embodiment having a plurality ofrecesses. FIG. 22 depicts a chip package 2200 at an intermediate stageof manufacturing. The embodiment shown in FIG. 22 has many similarfeatures to other embodiments discussed above. For example, the chippackage 2200 includes a leadframe 2201 having a main body 2202 and alead 2204 separated from the main body 2202 by a space 2206. Inaddition, the main body has a first recess 2208 that forms a recessaround a center die attach pad 2210 having a top surface 2212.

FIG. 22 depicts additional recesses in the main body 2202. Specifically,the main body 2202 includes a second recess 2214 forming a second recessadjacent to the first recess 2208. The second recess fully encircles thefirst recess. A portion of the main body 2202 between the first recess2208 and the second recess 2014 forms a first outer die attach support2216. The support 2216 has a top surface coplanar with the top surface2212, in some embodiments. The main body 2202 also includes a thirdrecess 2218 forming a third recess adjacent to the second recess 2214.The third recess fully encircles the second recess. A portion of themain body 2202 between the second recess 2214 and the third recess 2018forms a second outer die attach support 2220. The support 2220 has a topsurface coplanar with the top surface 2212 or the top surface of thesupport 2216, in some embodiments. Similarly, the main body 2202 alsoincludes a fourth recess 2222 forming a fourth recess adjacent to thethird recess 2218. The fourth recess fully encircles the third recess. Aportion of the main body 2202 between the third recess 2218 and thefourth recess 2022 forms a third outer die attach support 2224. Thesupport 2224 has a top surface coplanar with the top surface 2212, thetop surface of the support 2216, or the top surface of the support 2220,in some embodiments. Between an outside edge of the main body 2202 andthe fourth recess 2222 is an anchor 2226. The anchor 2226 may be any ofthe types discussed above with respect to the other embodiments. Theanchor 2226 has a top surface coplanar with the top surface 2212, thetop surface of the support 2216, the top surface of the support 2220, orthe top surface of support 2224, in some embodiments.

The rows of recesses provide similar functionality as discussed abovewith respect to other embodiments. The recesses 2208, 2214 are in theform of a series of groves or trenches that surround the die pad 2210.For instance, a semiconductor die may be positioned on the die attachpad 2210 with an adhesive between the semiconductor die and the mainbody 2202. As the semiconductor die is compressed downward towards themain body 2202, excess adhesive is compressed and pushed to exterioredges of the semiconductor die. Because of the tendency of the adhesiveto adhere to the semiconductor die, a mechanism is provided that helpsprevent the adhesive from trying to climb the exterior edges of thesemiconductor die. At least one of the recesses shown in FIG. 22 mayprovide this functionality. For instance, a semiconductor die with afootprint slightly larger than a footprint of the die attach pad 2210will be positioned at a first die placement outline 2228. In thisposition, the semiconductor die will overhang the first recess 2208. Asthe semiconductor die is positioned at the first die placement outline2228, excess adhesive will be compressed out from between thesemiconductor die and the die attach pad 2210, and will flow into thefirst recess 2208, preventing the adhesive from climbing up the exterioredges of the semiconductor die.

The additional recesses shown in FIG. 22 allow for the functionalitydescribed above to be provided to semiconductor dice of different sizeswithout needing to redesign the leadframe 2201. For example, in theembodiment depicted in FIG. 22, a semiconductor die may be used that islarger than the one depicted positioned at the first die placementoutline 2228. This larger die may be positioned at a second dieplacement outline 2230. In this position, the semiconductor die willcover the first recess 2208 and may slightly overhang the second recess2214. As the semiconductor die is positioned at the second die placementoutline 2230, excess adhesive will be compressed out from between thesemiconductor die and the die attach pad 2210. The excess adhesive willfill some or all of the first recess 2208 and also overflow into thesecond recess 2214, preventing the adhesive from climbing up theexterior edges of the semiconductor die.

Even larger dice may be used with the leadframe 2201. In one embodiment,a larger semiconductor die is positioned at a third die placementoutline 2232. In this position, the semiconductor die will cover thefirst recess 2208, the second recess 2014, and will overhang the thirdrecess 2218. As the semiconductor die is positioned at the third dieplacement outline 2232, excess adhesive will be compressed out frombetween the semiconductor die and the die attach pad 2210. The excessadhesive may fill some or all of the first recess 2208, the secondrecess 2214, and then has room to overflow into the third recess 2218,preventing the adhesive from climbing up the exterior edges of thesemiconductor die. Adhesive may be placed on top of the various supports2216, 2220, 2224, etc., to provide further bonding of the die to theleadframe.

The embodiment shown in FIG. 22 may also be used with a semiconductordie that at least partially covers all recesses in the leadframe 2201.For example, a larger semiconductor die is positioned at a fourth dieplacement outline 2234. In this position, the semiconductor die willcover the first recess 2208, the second recess 2014, the third recess2218, and will overhang the fourth recess 2222. As the semiconductor dieis positioned at the fourth die placement outline 2234, excess adhesivewill be compressed out from between the semiconductor die and the dieattach pad 2210. The excess adhesive will fill the first recess 2208,the second recess 2214, the third recess 2218, and then overflow intothe fourth recess 2222, preventing the adhesive from climbing up theexterior edges of the semiconductor die.

Some of the embodiments described throughout this specification includethe variations below. In some embodiments, an adhesive is applied onlyto a die attach pad. In other embodiments, the adhesive is applied onlyin a recess. In yet other embodiments, adhesive is applied to somecombination of features; including at least one of a die attach pad, afirst recess, a second recess, a first support, and a second support.Furthermore, the leadframes described above may be used withsemiconductors of different sizes and different shapes. For instance, asemiconductor die with any non-square shaped footprint may be used. Theleadframes described may also support more than one die, and may supporta die not centrally placed on the main body of the leadframe.

Some embodiments may also include a fifth recess 2236. While the first,second, third, and fourth recesses shown in FIG. 22 form recesses thatgenerally run parallel to sides of the main body 2202, the fifth recess2236 generally runs radially from the center of a top surface the mainbody 2202 towards an edge of the main body 2202. The fifth recess 2236may form a drain recess that puts the various other recesses in fluidiccommunication with one another. For instance, the fifth recess mayfluidically connect the first recess 2208 to the second recess 2214. Inthis embodiment, as adhesive fills the first recess 2208, any excessadhesive from the first recess 2208 is expelled into the second recess2214 through the fifth recess 2236. This feature may provide the benefitof maintaining a more even distribution of adhesive under asemiconductor die and may also help prevent pockets of gas or othercontaminant from being trapped in a recess between the semiconductor dieand the main body 2202. The recess formed from the fifth recess 2236 maybe linear or nonlinear, for example a stair-step shape, and the recessmay be linear or discontinuous between recesses. Additionally, the fifthrecess may form a recess that connects all recesses, or less than allrecesses.

In addition, the fifth recess may include an overflow extension 2238.Overflow extension 2238 is an extension of the recess formed by thefifth recess 2236 beyond the outer recess formed by the fourth recess2222. The overflow extension 2238 does not connect two recessestogether, but instead provides a cavity for excess adhesive to flow tofrom the recesses as the semiconductor die is positioned on the mainbody 2202.

Also included in the embodiment shown in FIG. 22 is a sixth recess 2240in the outer edge of the main body 2202. The sixth recess 2240 providesan alignment marker for orientation of the main body 2202. The alignmentmarker may be detected optically or electronically, and may be detectedin any one of many different stages of manufacturing, includingimmediately after the initial formation of the leadframe 2201 to afterthe finalization of the chip package 2200. In some embodiments thealignment marker will be visible through an opening in an encapsulantaround the leadframe 2201 and a semiconductor die.

FIG. 23 is an isometric view of the embodiment shown in FIG. 22. FIG. 23depicts the chip package 2200 discussed above, with the leadframe 2201having the main body 2202. The main body is shown with recesses definingthe center die attach pad 2210 and the outer die attach supports 2216,2220, 2224, and 2226. Furthermore, the fifth recess 2236 is depictedforming a drain recess that fluidically connects adjacent recesses. Alsodepicted is the sixth recess 2240 forming an alignment marker on themain body 2202.

FIG. 24 is an isometric view of an alternate embodiment having aplurality of recesses. FIG. 24 depicts a chip package 2400 at anintermediate stage of manufacturing. The embodiment shown has manysimilar features to other embodiments discussed above. The chip package2400 includes a leadframe 2401 having a main body 2402. However, in thisembodiment a plurality of recesses are formed in close proximity to forma crossing pattern of recesses. The crossing patterns of recesses formsdie attach support columns. For example, the main body 2402 includes afirst recess 2406 that forms a first recess, and a second recess 2408that forms a second recess at least approximately parallel to the firstrecess. The main body 2402 also includes a third recess 2410 that formsa third recess, and a fourth recess 2412 that forms a fourth recess atleast approximately parallel to the third recess. The first recess is atleast approximately perpendicular to the third recess, thus theintersection of the first, second, third, and fourth recesses forms adie attach support column 2414. The embodiment depicted in FIG. 24includes a plurality of recesses forming a plurality of die attachsupport columns. In the embodiment of FIG. 24, the die pad can beconsidered as a group of columns 2414 that work together to support thedie. In some embodiments, the main body 2402 may also include one ormore center die attach pads anywhere on the same side as the die attachsupport columns. At an edge of the main body 2402, the leadframe 2401may include an anchor 2404 as described with respect to other figures.

FIG. 25 is an isometric view of an alternate embodiment having aplurality of recesses. FIG. 25 depicts a chip package 2500 at anintermediate stage of manufacturing. The embodiment shown has manysimilar features to other embodiments discussed above. The chip package2500 includes a leadframe 2501 having a main body 2502. However, in thisembodiment a plurality of recesses are not formed as uniform recesses.The recesses instead have a varying shape, such as the ones shown inFIG. 25. A first recess 2508 is formed adjacent to a center die attachpad 2506. The first recess extends from a first side of the die attachpad 2506 to a second side opposite the first side. The first recess 2508forms one side of a first die attach support 2510. A second recess 2512extends along a third side of the die attach pad 2506 from a positionbeyond the first recess 2508 and including the first die attach support2510. The second recess 2512 forms one side of a second die attachsupport 2514. In the embodiment shown in FIG. 25, the first die attachsupport 2510 has a smaller volume than the second die attach support2514. In some embodiments, the first recess 2508 is in fluidiccommunication with the second recess. The first and second recesses mayform a pattern that is repeated radially from a center of the die pad,or from some other origin point. At an edge of the main body 2502, theleadframe 2501 may include an anchor 2504 as described with respect toother figures.

The various embodiments described above can be combined to providefurther embodiments. Aspects of the embodiments can be modified, ifnecessary to employ concepts of the various patents, applications andpublications to provide yet further embodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

1. A device, comprising: a leadframe having a main body, the main bodyhaving a first side and a second side opposite the first side; a firstrecess in the first side of the main body; a die attach pad on the firstside of the main body, the die attach pad adjacent to the first recess;a semiconductor die attached to the die attach pad, the semiconductordie having a portion that is directly above and overlying a firstportion of the first recess; and an adhesive layer between thesemiconductor die and the die attach pad, edges of the semiconductor dieextending past edges of the adhesive layer.
 2. The device of claim 1wherein the adhesive layer is located in the recess, positioned belowand underlying the semiconductor die.
 3. The device of claim 1 whereinthe first recess has a maximum depth from the first side that is lessthan a distance between the first side and the second side of the mainbody.
 4. The device of claim 1 wherein a second portion of the firstrecess extends beyond an edge of the semiconductor die, to be below theedge of the semiconductor die.
 5. The device of claim 1 wherein the mainbody includes a second recess through the first side of the main body,with the semiconductor die above and overlaying a portion of the secondrecess.
 6. The device of claim 5, wherein the die attach pad is betweenthe first recess and the second recess.
 7. The device of claim 6 whereinthe main body has a third side, the third side orthogonal to the firstside, a surface of the first side of the main body between the thirdside and the first recess coplanar to a surface of the first side of themain body at the die attach pad.
 8. The device of claim 6 wherein themain body has a third side, the third side orthogonal to the first side,a portion of the main body between the third side and the first recessforms a merlon and crenel pattern.
 9. The device of claim 8 wherein asurface of a merlon facing a crenel has curvature.
 10. The device ofclaim 6 wherein a length of the first side of the main body is greaterthan a length of the second side of the main body.
 11. The device ofclaim 1, further comprising: a second recess in the first side of themain body, the semiconductor die extending over the entirety of thesecond recess. 12-17. (canceled)
 18. A system, comprising: asemiconductor package, including: a semiconductor die having a firstside, a second side opposite the first side, and a third side orthogonalto the first side and between the first side and the second side; aleadframe body having a fourth side, the leadframe body including afirst recess in the fourth side; and an adhesive coupling the first sideof the semiconductor die to the fourth side of the leadframe body, theadhesive coupled to a surface of the fourth side, a surface of the firstrecess, and a surface of the first side, the first recess configured toprevent the adhesive from coupling to the second side or the third sideof the semiconductor die.
 19. The system of claim 18, furthercomprising: an encapsulant, the encapsulant over in a first portion ofthe first recess and on the semiconductor die over a second portion ofthe first recess.
 20. The system of claim 18 wherein a surface of therecess has curvature.
 21. The system of claim 18 wherein a portion of asurface of the recess has a rough texture.
 22. The system of claim 18wherein the leadframe body includes a second recess in the fourth sideof the leadframe body, the second recess covered by the semiconductordie.
 23. The system of claim 22 wherein the leadframe body includes anouter die attach support and a third recess in the fourth side of theleadframe body, a center die attach pad between the second recess andthe third recess.
 24. The system of claim 22 wherein the leadframe bodyincludes a fourth recess in the fourth side of the leadframe body, thefourth recess connecting the first recess to the second recess.
 25. Adevice, comprising: a leadframe main body having a first side and asecond side, the leadframe main body having a first width in a firstdirection; a die attach pad extending upward from the first side of theleadframe main body, the die attach pad having a second width in thefirst direction, the first width being greater than the second width; asemiconductor die on the die attach pad, the semiconductor die having athird width in the first direction; and an adhesive layer between thesemiconductor die and the die attach pad, the adhesive layer having afourth width in the first direction, the fourth width being less thanthe third width, the adhesive layer configured to couple thesemiconductor die to the die attach pad.
 26. The device of claim 25wherein the adhesive layer has a fifth width in the first direction, thefifth width being less than the first width and being greater than thesecond width.
 27. The device of claim 26 wherein the semiconductor diehas a sixth width in the first direction, the sixth width being lessthan the first width and being greater than the fifth width.
 28. Thedevice of claim 25 wherein the die attach pad has a first height in asecond direction orthogonal to the first direction and the leadframemain body has a second height in the second direction, the first heightbeing less than the second height.
 29. The device of claim 25 whereinthe semiconductor die extends over a first edge of the die attach padand over a second edge of the die attach pad opposite the first edge.30. The device of claim 5, further comprising: an encapsulant anchor onand extending from a first side of the leadframe main body, theencapsulant anchor spaced away from the die attach pad, the encapsulantanchor having a surface coplanar with the surface of the die attach pad.31. A device, comprising: a leadframe main body having a first side anda second side, the leadframe main body having a first width in a firstdirection; a die attach pad extending upward from the first side of theleadframe main body, the die attach pad having a second width in thefirst direction, the first width being greater than the second width; asemiconductor die on the die attach pad; and an adhesive layer betweenthe semiconductor die and the die attach pad, the adhesive layerconfigured to couple the semiconductor die to the die attach pad, theadhesive layer has a third width in the first direction, the third widthbeing less than the first width and being greater than the second width,the semiconductor die has a fourth width in the first direction, thefourth width being less than the first width and being greater than thethird width.
 32. A device, comprising: a leadframe having a main body,the main body having a first side and a second side opposite the firstside; a first recess in the first side of the main body; a second recessin the first side of the main body; a die attach pad on the first sideof the main body, the die attach pad adjacent to the first recess; asemiconductor die attached to the die attach pad, the semiconductor diehaving a portion that is directly above and overlying a first portion ofthe first recess, the semiconductor die extending over the entirety ofthe second recess; and an adhesive layer between the semiconductor dieand the die attach pad that adheres the die to the die attach pad.